Utilization of Moringa seed pods as raw material and epoxy resin as binder for particleboard/

Chicano, Kent Lenard V.

Utilization of Moringa seed pods as raw material and epoxy resin as binder for particleboard/ Kent Lenard V. Chicano, Russel M. Gregorio, Ronald Carlo D. Loquinerio, Edilberto S. Surio, Wesly D. Tapida, and John Clyde B. Ticon .-- - Manila: Technological University of the Philippines, 2024. - ix, 122pages: 29cm.

Thesis (undergraduate)

College of Industrial Technology .--

Includes bibliography:

BTH TH 438 / C45 2024



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