| 000 | 01299pam a2200337 a 4500 | ||
|---|---|---|---|
| 001 | 47DA4846D76C4122B99C625F6D067887 | ||
| 003 | OSt | ||
| 005 | 20240709152802.0 | ||
| 008 | 920430s1993 nyua b 001 0 eng | ||
| 010 | _a 92016442 | ||
| 020 | _a0070418535 | ||
| 035 | _a4868571 | ||
| 040 |
_aDLC _cDLC _dDLC |
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| 050 | 0 |
_aTK 7871.85 _bM52 1993 |
|
| 082 | 0 |
_a621.3815/2 _220 |
|
| 100 | 1 | _aMiddleman, Stanley. | |
| 245 | 0 | 0 |
_aProcess engineering analysis in semiconductor device fabrication / _cStanley Middleman, Arthur K. Hochberg. |
| 260 |
_aNew York : _bMcGraw-Hill, _cc1993. |
||
| 300 |
_axvii, 774 p. : _bill. ; _c25 cm. |
||
| 440 | 0 | _aMcGraw-Hill chemical engineering series | |
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 1 | 0 |
_aSemiconductors _xDesign and construction. |
| 700 | 1 | _aHochberg, Arthur K. | |
| 906 |
_a7 _bcbc _corignew _d1 _eocip _f19 _gy-gencatlg |
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| 942 |
_2lcc _cBK |
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| 999 |
_c1271 _d1271 |
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