000 00977nam a2200289 i 4500
003 OSt
005 20240805113220.0
007 ta
008 220516s2017 nyua b 001 0 eng d
020 _a9781259587696 (hardbound)
020 _a125958769X
020 _a1259583120
040 _aTUPM
_beng
_erda
_cTUP-M
050 0 _aR TK
_b7871.85 S46 2018
245 0 0 _aSemiconductor manufacturing handbook /
_c[edited by] Hwaiyu Geng.
250 _aSecond edition.
264 1 _aNew York, NY :
_bMcGraw-Hill Education,
_c2018.
300 _axxxi, 525 pages :
_billustrations ;
_c26 cm.
336 _atext
_2rdacontent.
337 _aunmediated
_2rdamedia.
338 _avolume
_2rdacarrier.
504 _aIncludes bibliographical references and index.
650 1 0 _aSemiconductors
_xDesign and construction
_vHandbooks, manuals, etc.
650 1 0 _aIntegrated circuits
_xDesign and construction
_vHandbooks, manuals, etc.
700 1 _aGeng, Hwaiyu,
_eeditor.
942 _2lcc
_cBK
999 _c2277
_d2277