000 01257nam a22002897a 4500
003 OSt
005 20241202141929.0
008 241202b |||||||| |||| 00| 0 eng d
040 _aTUPM
_bEnglish
_cTUPM
_dTUPM
_erda
050 _aBTH TH 438
_bC45 2024
100 _aChicano, Kent Lenard V.
_eauthor
245 _aUtilization of Moringa seed pods as raw material and epoxy resin as binder for particleboard/
_cKent Lenard V. Chicano, Russel M. Gregorio, Ronald Carlo D. Loquinerio, Edilberto S. Surio, Wesly D. Tapida, and John Clyde B. Ticon .--
260 _aManila:
_bTechnological University of the Philippines,
_c2024.
300 _aix, 122pages:
_c29cm.
336 _2rdacontent
337 _2rdamedia
338 _2rdacarrier
500 _aThesis (undergraduate)
502 _aCollege of Industrial Technology .--
_bBachelor of Engineering Technology major in Construction Technology:
_cTechnological University of the Philippines,
_d2024
504 _aIncludes bibliography:
700 _aGregorio, Russel M.
_eauthor
700 _aLoquinerio, Ronald Carlo D.
_eauthor
700 _aSurio, Edilberto S.
_eauthor
700 _aTapida, Wesly D.
_eauthor
700 _aTicon, John Clyde B.
_eauthor
942 _2lcc
_cBTH CIT
_n0
999 _c29144
_d29144