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Utilization of Moringa seed pods as raw material and epoxy resin as binder for particleboard/ Kent Lenard V. Chicano, Russel M. Gregorio, Ronald Carlo D. Loquinerio, Edilberto S. Surio, Wesly D. Tapida, and John Clyde B. Ticon .--

By: Contributor(s): Material type: TextTextPublication details: Manila: Technological University of the Philippines, 2024.Description: ix, 122pages: 29cmContent type:
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  • BTH TH 438 C45 2024
Dissertation note: College of Industrial Technology .-- Bachelor of Engineering Technology major in Construction Technology: Technological University of the Philippines, 2024
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Thesis (undergraduate)

College of Industrial Technology .-- Bachelor of Engineering Technology major in Construction Technology: Technological University of the Philippines, 2024

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